EUVL Research Activity at Center for EUV Lithography

Longer Wavelength EUV Lithography (LW-EUVL)

Extreme UV Lithography (EUVL) is generally accepted as the leading candidate for next generation lithography. Several challenges remain for EUVL, especially as its insertion point is pushed to finer resolution. Although diffractive scaling may suggest a transition to shorter EUVL wavelengths, several issues arise that would make that difficult. Challenges involve issues such as flare, multilaye...

EUV Lithography—The Successor to Optical Lithography?

This paper discusses the basic concepts and current state of development of EUV lithography (EUVL), a relatively new form of lithography that uses extreme ultraviolet (EUV) radiation with a wavelength in the range of 10 to 14 nanometer (nm) to carry out projection imaging. Currently, and for the last several decades, optical projection lithography has been the lithographic technique used in the...

Approach to EUV Lithography Simulation

EUVL dosimetry at NIST

As part of its role in providing radiometric standards in support of industry, the National Institute of Standards and Technology has been active in advancing extreme ultraviolet dosimetry on various fronts. Recently, we undertook a major effort in accurately measuring the sensitivity of three extreme ultraviolet photoresists. It has been common practice to use photoresists as a transfer “stand...

Recent Progress of EUV Resist Technology in EIDEC

EUV lithography is one of the promising technologies for manufacturing devices at 16 nm half-pitch node and below. EUV resists are required to improve the resolution, line width roughness (LWR), and sensitivity. However it is generally thought that the lithographic performance is determined by the trade-off relationship among these factors. Moreover, resist outgassing is another issue with EUV ...